Basic Information of SEMICON China Exhibition

Date: March 26th - 28th
Venue: Shanghai New International Expo Centre
Address: No. 2345 Longyang Road, Pudong New Area, Shanghai
Festo Booth: Booth 6519, Hall E6

Highlights of Exhibition

Advanced Packaging Solution

Application: Advanced packaging process

Highlights：

The IC chips on tray are transported to the glue coating area for coating. The coated IC chips are then transported to the hot-pressing station through the conveyer for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the IC chips, greatly enhancing the overall reliability and productivity of the advanced packaging process. With support of Festo AX, it can easily monitor cylinder health rate, providing intelligent production for the semiconductor industry.

Core technology:

• 1 valve terminal VTEP controls all pressures that all applications required. We can also use VEAB as alternative solution.
• Pick and place application to control vacuum with high accuracy and also detect the failure of the suction cup
• Glueing application to show high accuracy of air pressure supplying for glue
• Pressing application to show high accuracy of pressing force
• With support of AX, it can easily monitor cylinder health rate

Lift-cup Synchronized Cylinder Control Solution

Application: Wafer wet cleaning station

Highlights: In the wafer wet cleaning station, the piezo valve VTEP accurately controls the synchronized movement of multiple low-friction cylinders to achieve continuously adjustable speed and position during the lifting up and down of the large-size wafer cup, preventing the cleaning solution from splashing out or remaining and avoiding cross-contamination. The precision and stability of the cup control directly affects the cleaning effect.

Core Products:

• Valve terminal VTEP : Piezo technology for precise pressure control
• Cylinder DFM : Low friction version, Synchronization of several cylinders
• Position transmitter SDAT : with position feedback, cylinder position control by means of position transmitter
• CPX-E controller : High-performance control and automation system focusing on motion control functions for handling technology
• Space-saving application by means of pneumatic components instead of electric solution

特殊气体供应控制单元(特气柜方案）

应用领域：应用于半导体厂务工艺段 (特气柜方案）

应用亮点：

• FSC（关断阀）：防止高压气体泄漏引起的气体爆炸和气体中毒，以及化学反应异常和地震引起的次生灾害。
• DFDM （防呆气缸）：保护气体钢瓶六角开关系统，防止手动拧开
• VTOC：节省空间，1个阀位上的2个3/2阀，就能实现特气柜中特殊气体隔膜阀的先导供气
• VHEF ：逻辑阀，切换正常和异常气体供应状态
• OH : 压力显示器，显示系统中是否有气压

核心产品

• CS
• DFDM气缸
• VTOC小型紧凑型阀岛
• FSC关断阀

冷却系统模块

应用领域：半导体光蚀刻、薄膜沉积等工艺段

应用亮点：

精准控制设备温度的专用冷却系统组件，维持设备在恒定的低温或特定的温度范围内运行，以确保生产过程的稳定性和芯片良率。

• 低温冷却，精准控制温度
• DFPK/VAVC低温版
• 定制化方案，本地测试

Gate Valve 门阀开关控制方案

应用领域：

半导体或光电产业之镀膜的生产线过渡腔室 (load-lock chamber) / 移载系统 (handling system) / 制程腔体 (process chamber)。

应用亮点：

• 大幅降低门阀开关时所产生的冲击力
• 应用程式在单一元件中达成多门阀的控制
• 借由数位参数集达成高重复精度
• 易于追踪，非常适用于工业物联网

核心产品：

• 压电阀岛VTEP
• 电气终端CPX
• 位置传送器SDAT-MHS

N2 Purge 氮气吹扫系统

应用领域：

适用于 EFFEM、STOCKER、FOUP、OHT和STB等各种晶圆输送和储存场合等需要微污染防治的半导体晶片先进制程。

应用亮点：

• 可透过流量控制与湿度检测进行精密的控制
• 压电阀设计达到精准的流量控制，高达 200 l/min
• 简化工程设计、调试和操作，整合化模组设计，即装即用的解决方案
• 可将多片MFC整合成阀岛进行设置

应用产品：

数字控制终端VTEM，比例流量控制阀VEMD，比例调压阀VPPE，压力感测器SPAN，气源处理装置组合MSB6

Lift Pin Control Solution

Application:

Bellows cylinders for controlling Lift Pins in semiconductor equipment.

Highlights:

• Precise control and monitoring of the time, speed and accuracy of the pneumatic technology in operation.
• Stable and synchronized up and down operation of the wafer, more stable travel time and less unplanned machine downtime.
• Standardized Lift Pin adjustment replaces manual adjustment and saves maintenance time.

Core products:

• VTEM
• CPX
• VEAB
• VFOE