Basic Information of SEMICON China Exhibition

Date: March 26th - 28th
Venue: Shanghai New International Expo Centre
Address: No. 2345 Longyang Road, Pudong New Area, Shanghai
Festo Booth: Booth 6519, Hall E6

Highlights of Exhibition

Advanced Packaging Solution

Application: Advanced packaging process

Highlights：

The IC chips on tray are transported to the glue coating area for coating. The coated IC chips are then transported to the hot-pressing station through the conveyer for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the IC chips, greatly enhancing the overall reliability and productivity of the advanced packaging process. With support of Festo AX, it can easily monitor cylinder health rate, providing intelligent production for the semiconductor industry.

Core technology:

• 1 valve terminal VTEP controls all pressures that all applications required. We can also use VEAB as alternative solution.
• Pick and place application to control vacuum with high accuracy and also detect the failure of the suction cup
• Glueing application to show high accuracy of air pressure supplying for glue
• Pressing application to show high accuracy of pressing force
• With support of AX, it can easily monitor cylinder health rate

Lift-cup Synchronized Cylinder Control Solution

Application: Wafer wet cleaning station

Highlights: In the wafer wet cleaning station, the piezo valve VTEP accurately controls the synchronized movement of multiple low-friction cylinders to achieve continuously adjustable speed and position during the lifting up and down of the large-size wafer cup, preventing the cleaning solution from splashing out or remaining and avoiding cross-contamination. The precision and stability of the cup control directly affects the cleaning effect.

Core Products:

• Valve terminal VTEP : Piezo technology for precise pressure control
• Cylinder DFM : Low friction version, Synchronization of several cylinders
• Position transmitter SDAT : with position feedback, cylinder position control by means of position transmitter
• CPX-E controller : High-performance control and automation system focusing on motion control functions for handling technology
• Space-saving application by means of pneumatic components instead of electric solution

Special Gas Treatment Solution (Gas cabinet)

Application：Semiconductor Front-end Facility process (Gas cabinet application)

Highlights:

• FSC（Shut-off Valve) : prevent gas explosion and gas poisoning caused by leakage of high-pressure gas, and secondary disaster caused by abnormal chemical reaction and earthquake.
• DFDM (Auto guard Cylinder) : Cover hexagonal connector of gas cylinder to prevent from unscrewing manually
• VTOC : space-saving 2X3/2-way valves on one valve position to pilot control special gas diaphragm valves in gas cabinet application
• VHEF ：4 X OR logic valves for switching normal and abnormal gas supplying status
• OH : indicate the presence of air pressure in pneumatic system

Core Products:

• DFDM
• VTOC
• OS-PK-3
• OH-22-RT

Chiller Block

Application：Semiconductor lithography, etching, thin film deposition

Highlights:

Dedicated cooling system components that accurately control the temperature of the equipment maintain the equipment at a constant low temperature or within a specific temperature range to ensure process stability and chip yields.

• Low temperature chilling for a fast processing and high performance
• Block with low temperature version of 6 X DFPK / VAVC
• Customized solution with local test

Gate Valve Control Solution

Application:

Load-lock chambers / handling systems / process chambers for production lines in the semiconductor and photovoltaic industries.

Highlights:

• Significantly reduces the shock force generated when opening and closing valves
• Application programmes allow control of multiple valves in a single unit
• High repeatability thanks to digital parameter set
• Easy traceability, ideal for the Industrial IoT

Core Products:

• VTEP
• CPX
• SDAT-MHS

N2 Purge Solution

Application:

Suitable for advanced processes of semiconductor wafers requiring micro-contamination control, such as EFFEM, STOCKER, FOUP, OHT, and STB for various wafer handling and storage applications.

Highlights:

• Precise control through flow control and humidity detection
• Piezo valve design for precise flow control up to 200 l/min
• Simplified engineering, commissioning and operation, integrated module design, ready-to-use solution
• Multiple MFCs can be integrated into a valve island for setup

Core products:

• VTEM
• VEMD
• VPPE
• SPAN

Lift Pin Control Solution

Application:

Bellows cylinders for controlling Lift Pins in semiconductor equipment.

Highlights:

• Precise control and monitoring of the time, speed and accuracy of the pneumatic technology in operation.
• Stable and synchronized up and down operation of the wafer, more stable travel time and less unplanned machine downtime.
• Standardized Lift Pin adjustment replaces manual adjustment and saves maintenance time.

Core products:

• VTEM
• CPX
• VEAB
• VFOE