Festo Booth: Hall 1, 1st Floor, J3146
Application Areas:
With continuous improvements in semiconductor processes, warpage of wafers or substrates frequently occurs in metrology, wafer bonding, advanced packaging, etc. Although contact (downforce) solutions exist on the market, challenges remain regarding installation space and process requirements. Festo proposes a new “non-contact” solution.
This solution combines Festo’s digital and piezoelectric technologies to achieve extremely precise pressure zoned control. Additionally, we have the capability to deeply collaborate with customers for joint development, providing complete solutions to tackle warpage challenges together.
Application Highlights:
Application Areas:
The flow channel transports to the gluing area for coating, then to the heat pressing station for thermal curing and bonding of products and adhesives. Closed-loop force control modules are used to precisely control pressing force and protect products.
Application Highlights:
应用领域：
用于溅镀、蚀刻工程中的平台冷却等温度控制装置，要求具备高精度且温度稳定。1 半导体前段制程设备方案
应用亮点：
应用领域：
半导体或光电产业之镀膜的生产线过渡腔室 (load-lock chamber) / 移载系统 (handling system) / 制程腔体 (process chamber)
应用亮点：
订制方案：
半导体行业 EFEM 晶圆传送设备内，数字控制终端系统及精细的压电控制技术对 FOUP 载具填充惰性气体的应用解决方案，能有效降低 slit/gate valve 于关门时的冲击力，减少扬尘与震动，对于提升良率与门阀的寿命延长有显著的效果。
应用领域：
应用于半导体前段制程中，特殊气体供应以及化学打磨气体控制。
应用亮点：
订制方案：
应用领域：
Load Port / Slide Track Buffer / OHC Purge System / FOUP Stocker
应用亮点：
在半导体行业 N2 Purge 吹净系统中，Festo 的气体控制应用解决方案通过各类传感器和流量控制器配合，实现系统集成设计。借助压电阀精准的比例式控制，实现细致的流量调节，并通过通讯实现数据采集与传输。
定制方案：