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  4. 2025 SEMICON TW

Creating Win-Win Innovation, Manufacturing Value

Global Partner Providing One-Stop Solutions for the Semiconductor Industry

In the wave of technological advancement, semiconductors, as a core driving force, are reshaping the world at an unprecedented speed. Facing various challenges in semiconductor manufacturing, Festo, a century-old global automation company, consistently drives innovation and excellence in quality, injecting new momentum into the semiconductor industry. The world’s second-largest professional semiconductor exhibition, SEMICON Taiwan, will be grandly held from September 10 to 12 at the Taipei Nangang Exhibition Center. Under the theme “Creating Win-Win Innovation, Manufacturing Value,” Festo will showcase a series of advanced automation solutions and innovative industry applications, helping semiconductor manufacturers break through strongly in the “chip” wave. We sincerely invite you to visit the exhibition and communicate with us face-to-face to explore the unlimited possibilities of semiconductor development.

SEMICON Taiwan 2025 | Basic Information

  • Date: September 10–12
  • Venue: Taipei Nangang Exhibition Center
  • Address: No. 1, Jingmao 2nd Rd, Nangang District, Taipei City

Festo Booth: Hall 1, 1st Floor, J3146

Highlights

Warped Wafer Solutions

Application Areas:

With continuous improvements in semiconductor processes, warpage of wafers or substrates frequently occurs in metrology, wafer bonding, advanced packaging, etc. Although contact (downforce) solutions exist on the market, challenges remain regarding installation space and process requirements. Festo proposes a new “non-contact” solution.
This solution combines Festo’s digital and piezoelectric technologies to achieve extremely precise pressure zoned control. Additionally, we have the capability to deeply collaborate with customers for joint development, providing complete solutions to tackle warpage challenges together.

Application Highlights:

  • Use of VTEM/VTEP proportional (positive and negative) pressure control valve islands and Festo’s patented control technology to achieve multi-channel precise pressure control
  • VTUX multi-channel vacuum switch control, supporting multiple communication protocols, maximizing integration of control, data feedback, and digital functions
  • Proven successful cases with the ability to co-develop customized solutions with customers
  • Provide chuck design concepts and suggestions to accelerate customers’ design schedules and shorten validation time

Advanced Packaging Process: Spot Gluing and Heat Sink Pressing Machine Solutions

Application Areas:
The flow channel transports to the gluing area for coating, then to the heat pressing station for thermal curing and bonding of products and adhesives. Closed-loop force control modules are used to precisely control pressing force and protect products.

Application Highlights:

  • One VTEP valve island controls all system pressure needs; piezo valves with manifolds (VEAB) can also be used
  • Precise vacuum control for pick-and-place, with suction cup fault detection
  • High pressure accuracy for gluing and pressing
  • AI-powered Festo AX easily monitors cylinder health

Semiconductor Front-End Process Equipment Solutions

Application Areas:
Used in temperature control devices for platform cooling in sputtering and etching processes, requiring high precision and stable temperature.

Application Highlights:

  • Cooling units with special angle valves can reach -60℃
  • Interlock valve systems prevent gas mixing and ensure safety
  • Digital and physical information separated from the system
  • High-precision control of ISO valves via piezo valves (VEAB)

Gate Valve Shock Absorption Solutions

Application Areas:
Load-lock chambers, handling systems, and process chambers in semiconductor or optoelectronic industry coating production lines.

Application Highlights:

  • Significantly reduce impact forces during gate valve opening and closing
  • Single component controls multiple valves
  • Achieve high repeatability through digital parameter sets
  • Extend gate valve service life and reduce dust generated by valve operation

Customized Solution:
In semiconductor EFEM wafer transfer equipment, digital control terminal systems and precise piezo control technology for FOUP inert gas filling applications effectively reduce slit/gate valve impact forces during closing, minimize dust and vibration, significantly improving yield and extending valve life.

Gas Cabinet: Special Gas Supply and Chemical Etching Gas Control Units

Application Areas:
Used in front-end semiconductor processes for special gas supply and chemical etching gas control.

Application Highlights:

  • Can cut off gas supply from cylinders without power source
  • Special “OR” valve design ensures uninterrupted system control
  • Hot-swappable solenoid valves allow replacement without shutting off gas supply

Customized Solutions:

  • Manual valves and logic valves customized with multi-channel manual safety loops and more compact structure
  • Specially designed manual accumulator gas cylinder switch system retains manual operation while autonomously shutting off gas cylinders without power
  • Simple customized cylinder-driven red indicators save space and ensure operational safety

MFC Mass Flow Controller

Application Areas:
Load Port / Slide Track Buffer / OHC Purge System / FOUP Stocker

Application Highlights:
In the semiconductor industry’s N2 purge cleaning systems, Festo’s gas control solutions integrate various sensors and flow controllers to achieve system integration. Utilizing piezo valve’s precise proportional control, it delivers fine flow regulation while enabling data collection and transmission through communication interfaces.

Customized Solutions:

  • Piezo valve design enables accurate flow control, offering multiple flow ranges: 200 / 100 / 50 / 20 LPM
  • Integrated modular design includes vacuum humidity detection, precise flow control, and calibration
  • Supports RS485 communication and analog signals.