SEMICON Taiwan 2025 | Basic Information

• Date: September 10–12
• Venue: Taipei Nangang Exhibition Center
• Address: No. 1, Jingmao 2nd Rd, Nangang District, Taipei City

Festo Booth: Hall 1, 1st Floor, J3146

Highlights

Warped Wafer Solutions

Application Areas:

With continuous improvements in semiconductor processes, warpage of wafers or substrates frequently occurs in metrology, wafer bonding, advanced packaging, etc. Although contact (downforce) solutions exist on the market, challenges remain regarding installation space and process requirements. Festo proposes a new “non-contact” solution.
This solution combines Festo’s digital and piezoelectric technologies to achieve extremely precise pressure zoned control. Additionally, we have the capability to deeply collaborate with customers for joint development, providing complete solutions to tackle warpage challenges together.

Application Highlights:

• Use of VTEM/VTEP proportional (positive and negative) pressure control valve islands and Festo’s patented control technology to achieve multi-channel precise pressure control
• VTUX multi-channel vacuum switch control, supporting multiple communication protocols, maximizing integration of control, data feedback, and digital functions
• Proven successful cases with the ability to co-develop customized solutions with customers
• Provide chuck design concepts and suggestions to accelerate customers’ design schedules and shorten validation time

Advanced Packaging Process: Spot Gluing and Heat Sink Pressing Machine Solutions

Application Areas:
The flow channel transports to the gluing area for coating, then to the heat pressing station for thermal curing and bonding of products and adhesives. Closed-loop force control modules are used to precisely control pressing force and protect products.

Application Highlights:

• One VTEP valve island controls all system pressure needs; piezo valves with manifolds (VEAB) can also be used
• Precise vacuum control for pick-and-place, with suction cup fault detection
• High pressure accuracy for gluing and pressing
• AI-powered Festo AX easily monitors cylinder health

Semiconductor Front-End Process Equipment Solutions

Application Areas:
Used in temperature control devices for platform cooling in sputtering and etching processes, requiring high precision and stable temperature.

Application Highlights:

• Cooling units with special angle valves can reach -60℃
• Interlock valve systems prevent gas mixing and ensure safety
• Digital and physical information separated from the system
• High-precision control of ISO valves via piezo valves (VEAB)

Gate Valve Shock Absorption Solutions

Application Areas:
Load-lock chambers, handling systems, and process chambers in semiconductor or optoelectronic industry coating production lines.

Application Highlights:

• Significantly reduce impact forces during gate valve opening and closing
• Single component controls multiple valves
• Achieve high repeatability through digital parameter sets
• Extend gate valve service life and reduce dust generated by valve operation

Customized Solution:
In semiconductor EFEM wafer transfer equipment, digital control terminal systems and precise piezo control technology for FOUP inert gas filling applications effectively reduce slit/gate valve impact forces during closing, minimize dust and vibration, significantly improving yield and extending valve life.

Gas Cabinet 特殊气体供应和化学打磨气体控制单元

应用领域：
应用于半导体前段制程中，特殊气体供应以及化学打磨气体控制。

应用亮点：

• 无需动力源，仍能切断气体钢瓶的气体供应
• 采用特殊的“或”阀设计，使系统控制不中断
• 热插拔功能，不需要关闭气源就能更换电磁阀

订制方案：

• 采用手动阀和逻辑阀订制，具有多路控制的手动安全回路，同时结构更加紧凑。
• 特殊设计的手动蓄能气体钢瓶开关系统，既保留手动操作方式，又能在没有任何动力源的条件下自主关闭气体钢瓶。
• 简易的订制化气缸驱动的红色指示器，节约空间的同时保障操作安全。

MFC 质量流量控制器

应用领域：
Load Port / Slide Track Buffer / OHC Purge System / FOUP Stocker

应用亮点：
在半导体行业 N2 Purge 吹净系统中，Festo 的气体控制应用解决方案通过各类传感器和流量控制器配合，实现系统集成设计。借助压电阀精准的比例式控制，实现细致的流量调节，并通过通讯实现数据采集与传输。

定制方案：

• 压电阀设计实现精准流量控制，提供多种流量范围：200 / 100 / 50 / 20 LPM
• 集成化模块设计，包含真空湿度检测 + 精准流量控制 + 克
• 支持 RS485 通讯与模拟信号。